Technology Silicone Chemical type Non curing Appearance Smooth paste Colour Milky white Application Heat transfer / Heat sink compound Anabond 652C is a heat transfer compound that is formulated with polydimethyl siloxane fluids in combination with metallic oxide fillers to provide superior thermal conductivity. It is designed for use as a heat transfer compound in both the electrical, an electronic industries, and is characterized by its high thermal conductivity, high dielectric constant, and high dissipation factor, Anabond 652C is an ideal material for use in thermocouples, power diodes, transistors, semi conductors, etc. Anabond 652C exhibits excellent long term storage stability, without oil separation. Typical Properties Specific gravity at 30 ± 2°C ATM*-R004 (JIS* K6820) g/cc Weight loss at 200±5°C ATM-R009 % Viscosity at 300C, ATM R006 (JIS K6820) poise Flash Point Refer MSDS Electrical Properties Dielectric Strength kV/mm 7.2 Volume resistivity ohms-cm 8.79 X 10 Dissipation factor • at 100 Hz • at 1.0 Hz 0.2 X 10 0.025 Dielectric constant • at 100 Hz • at 1.0 Hz kV/mm 4.8 5.0 Arc resistance Sec 77 Thermal Properties Thermal conductivity • at 35 ºC • at 66 ºC • at 86 ºC W/mK 0.399 0.403 0.437 Anabond® 652 C Japanese Industrial standard, ASTM – American Society for testing and materials, BS Heat transfer / Heat sink compound Anabond 652C is a heat transfer compound that is formulated with polydimethyl siloxane fluids in combination with metallic oxide fillers to provide superior thermal conductivity. It is designed for use as a heat transfer compound in both the electrical, and the electronic industries, and is characterized by its high thermal conductivity, high dielectric constant, and high dissipation factor, Anabond 652C is an ideal material for use in thermocouples, power diodes, transistors, semi652C exhibits excellent lo
Additional Information:
- Production Capacity: 1000
- Delivery Time: EX stock
- Packaging Details: BOX PACKING
